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Molding System "Hot Melt Molding"

Hot melt application system for protecting and waterproofing electrical components and electronic circuit boards.

Precision parts in fields such as automobiles, communications, home appliances, and electronics must achieve high performance at low cost. Additionally, to demonstrate reliable functionality and performance under any environmental conditions, such as heat, humidity, dust, chemicals, and vibration, it is necessary to specially protect the components. The optimal solution is to mold the parts using thermoplastic polyamide/polyester/polyolefin resins and moisture-curing resins (PUR-HM). Nordson offers functional, economical, and highly reliable molding methods. 【Features】 ○ Innovative technology using a single-component thermoplastic high-performance resin that is solvent-free and environmentally friendly. ○ Low pressure allows for the simplest and most diverse molding methods. For more details, please contact us or download the catalog.

  • Molding Equipment

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Hot Melt Molding System

Hot Melt Molding System

Molding equipment with built-in applicator for centralized management of temperature data, molding conditions, etc. From filling and potting to hot melt resin molding 【Features】 ○ Easy maintenance and cleaning due to the newly designed tank structure ○ Precise quantitative discharge using a gear pump ○ The tank section can be completely sealed, allowing for inert gas supply and pressurization with pneumatic pressure, making it compatible with moisture-curing and high-viscosity resins ○ Vacuum degassing during resin injection is possible by connecting a vacuum pump, etc. ○ High safety standards in accordance with international regulations ● For other functions and details, please download the catalog.

  • Printed Circuit Board
  • Electrical equipment parts
  • glue

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